BeeProg2

 
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WARNING: BGA-Top-117 ZIF [70-0850] is discontinued product! Please go to discontinued products section to find the replacement.

  • 70-0850

  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operation (mechanical) life of ZIF socket - 10.000 actuations
  • made in Slovakia
Ord. no. 70-0850
Socket ZIF BGA100 OpenTop type
Connection to BGA-Bottom-X 8x25 + 3x20 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Adapter manual
  • For work with BGA device it is necessary put together BGA-Top-117 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software.
  • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
  • Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane and slightly press the device into ZIF socket.
  • The chip fit into ZIF socket very precise, therefore it right happen, the chip be shuck a bit into ZIF socket. Therefore we recoment to use the vacuum pen with large rubber cup. The suitable vacuum pen is attached to the BGA-Top-117 ZIF adapter delivery.
  • Do not push package while loading or releasing the lid.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA1.1-1.2
Ball HeightA10.30.350.4
Body ThicknessA2---
Ball Diameterb0.350.40.45
Body SizeD8.999.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-10-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.3-0.4
Body ThicknessA20.65-0.8
Ball Diameterb0.4-0.5
Body SizeD8.999.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-10-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA1.11.21.3
Ball HeightA10.30.350.4
Body ThicknessA2---
Ball Diameterb0.350.40.45
Body SizeD8.999.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-10-
Ball Array EGE-10-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+ BeeHive8S BeeHive4+ BeeHive4
BeeProg JetProg (DIL48, ISP)



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