Discontinued product! Please go to discontinued products section to find the replacement.
top board of BGA adapters
ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
operating (mechanical) warranty of ZIF socket - 500,000 actuations
Ord. no.
70-0266
Socket
ZIF BGA48 (accept package up to 48 balls), ClamShell type
Bottom
4 rows, 4x 25 pins, square, 0.6x0.6mm
Class
BGA/LGA
Subclass
BGA-Top
Adapter manual
For work with BGA device it is necessary put together BGA-Top-12 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
