BeeProg2

 
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  • 70-1079A

    Price: US $396.00 [read this!][read this!])
    Price 4-7: US $364.30
    Price 8+ : Ask for price [?]

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  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) life of ZIF socket - 10,000 actuations
  • made in Slovakia
Ord. no. 70-1079A
Socket ZIF BGA256, OpenTop type
Connection to BGA-Bottom-X 8x25 + 3x20 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Availability in stock 9 pcs. [other 26 pcs. This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 days]
Adapter manual
  • For work with BGA device it is necessary put together BGA-Top-208 ZIF (a) with some BGA-Bottom-X board according to the information provided by PG4UW software.
  • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
  • Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane.
  • Do not push package while loading or releasing the lid.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

See this brochure for details on proper package loading procedure

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA1.41.551.7
Ball HeightA10.3--
Body ThicknessA21--
Ball Diameterb0.40.50.6
Body SizeD-17-
Body SizeE-17-
Ball Pitche-1-
Ball Array DGD-16-
Ball Array EGE-16-
NAMESYMBOLMINNOMMAX
ProfileA--2.2
Ball HeightA10.3--
Body ThicknessA2--1.8
Ball Diameterb0.50.60.7
Body SizeD-17-
Body SizeE-17-
Ball Pitche-1-
Ball Array DGD-16-
Ball Array EGE-16-
NAMESYMBOLMINNOMMAX
ProfileA1.251.41.55
Ball HeightA10.3--
Body ThicknessA2--1.25
Ball Diameterb0.40.50.6
Body SizeD-17-
Body SizeE-17-
Ball Pitche-1-
Ball Array DGD-16-
Ball Array EGE-16-
NAMESYMBOLMINNOMMAX
ProfileA1.351.61.7
Ball HeightA10.250.4-
Body ThicknessA21.051.21.35
Ball Diameterb0.450.50.55
Body SizeD16.81717.2
Body SizeE16.81717.2
Ball Pitche-1-
Ball Array DGD-16-
Ball Array EGE-16-
NAMESYMBOLMINNOMMAX
ProfileA1.31.72.1
Ball HeightA10.30.50.7
Body ThicknessA2---
Ball Diameterb0.50.60.7
Body SizeD-17-
Body SizeE-17-
Ball Pitche-1-
Ball Array DGD-16-
Ball Array EGE-16-
NAMESYMBOLMINNOMMAX
ProfileA1.31.72.1
Ball HeightA10.30.50.7
Body ThicknessA2---
Ball Diameterb0.50.60.7
Body SizeD-17-
Body SizeE-17-
Ball Pitche-1-
Ball Array DGD-16-
Ball Array EGE-16-
NAMESYMBOLMINNOMMAX
ProfileA---
Ball HeightA10.30.350.45
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD16.91717.1
Body SizeE16.91717.1
Ball Pitche-1-
Ball Array DGD-16-
Ball Array EGE-16-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+ BeeHive8S BeeHive4+



This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.