BeeProg2

 
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WARNING: BGA-Top-242 ZIF-CS [70-1454] is discontinued product! Please go to discontinued products section to find the replacement.

  • 70-1454
    Move the cursor over the picture for additional view.

  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) life of ZIF socket - 500,000 actuations
  • made in Slovakia
Ord. no. 70-1454
Socket ZIF BGA130, ClamShell type
Connection to BGA-Bottom-X 8x25 + 3x20 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Adapter manual
  • For work with BGA device it is necessary put together BGA-Top-242 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.185--
Body ThicknessA2---
Ball Diameterb-0.29-
Body SizeD8.999.1
Body SizeE7.988.1
Ball Pitche-0.65-
Ball Array DGD-13-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.185--
Body ThicknessA20.680.730.78
Ball Diameterb-0.29-
Body SizeD8.999.1
Body SizeE7.988.1
Ball Pitche-0.65-
Ball Array DGD-13-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.170.220.27
Body ThicknessA2---
Ball Diameterb0.250.30.35
Body SizeD8.999.1
Body SizeE7.988.1
Ball Pitche-0.65-
Ball Array DGD-13-
Ball Array EGE-10-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+ BeeHive8S BeeHive4+



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Universal

Specialized for

BGA/LGA

exhibitions

okraj

NEPCON China 2017

25th - 27th Apr 2017
Shanghai World Expo Exhibition & Convention Center
hall no.: Hall 1
booth no.: 1N07
exhibitor: Programtek

Del Mar Electronics Fair

3rd - 4th May 2017
Del Mar Fairgrounds, San Diego, CA, USA
booth no.: Booth #5
exhibitor: BK Precision

All exhibitions »