Discontinued product! Please go to discontinued products section to find the replacement.
- top board of BGA adapters
- ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
- The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
- operating (mechanical) life of ZIF socket - 10,000 actuations
- made in Slovakia
|
| Ord. no. | 70-0322 |
| Socket | ZIF BGA88 OpenTop type |
| Connection to BGA-Bottom-X | 4 rows, 4x 25 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-26 ZIF with some BGA-Bottom-x board according to the information provided by PG4UW software.
- The top cover must be fully actuated (depressed) before inserting a package into the socket.
- Once fully actuated, drop the package into the socket from a height of 2 to 3mm above the seating plane.
- Do not push package while loading or releasing the lid.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
|
BGA88 |
 |
 |
Usable for programmer(s):
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
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