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  • special adapter, assigned for eMMC devices in BGA package
  • designed for TurboMode
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) warranty of ZIF socket - 500,000 actuations
  • s/n from 2579A-00129 supported from PG4UW software version 3.76
  • made in Slovakia
Ord. no. 70-2579A
Socket ZIF BGA153, ClamShell type
Bottom 4x25 pins, square, 0.6x0.6mm
Class BGA
Subclass BGA-Top
Availability in stock
1 pcs.
[
other 17 pcs.

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.

within 3 working days ]
70-2579A Move the cursor over the picture for additional view.

Price: US $769.00 [read this!]

Price 2-3: US $730.60

Price 4-7: US $707.50

Price 8+ : Ask for price [?]

Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:

    1. fixed discount when buying 4+ adapters of particular type,

    2. individual discount for quantities 8+ according to type of adapter and        demanded quantity. To get Quotation 8+ please click here: Ask for price

We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.

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Adapter manual

  • For work with BGA device it is necessary put together BGA-Top-278 ZIF-CS (a) with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.170.220.27
Body ThicknessA2---
Ball Diameterb0.250.30.35
Body SizeD12.91313.1
Body SizeE11.411.511.6
Ball Pitche-0.5-
Ball Array DGD-14-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.170.220.27
Body ThicknessA20.610.660.71
Ball Diameterb0.250.30.35
Body SizeD12.931313.07
Body SizeE11.4311.511.57
Ball Pitche-0.5-
Ball Array DGD-14-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.180.220.26
Body ThicknessA2---
Ball Diameterb0.250.30.35
Body SizeD-13-
Body SizeE-11.5-
Ball Pitche-0.5-
Ball Array DGD-14-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.150.20.25
Body ThicknessA2---
Ball Diameterb0.250.30.35
Body SizeD12.91313.1
Body SizeE11.411.511.6
Ball Pitche-0.5-
Ball Array DGD-14-
Ball Array EGE-14-

Usable for programmer(s):

BeeHive208S BeeHive204 BeeProg2 BeeProg2C
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