Ask for price

Adapter manual

• For work with BGA device it is necessary put together BGA-Top-291 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
• The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
• Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
• Check this brochure (https://www.elnec.com/sw/3m_tweezer_handling.pdf) for details on proper insertion procedure of chip/device into this ZIF socket.
• Check attached brochure for details on proper insertion procedure of chip/device into this ZIF socket.
• The picture show, how to put together the BGA-Top-X ZIF and BGA-Bottom-X boards to have complete BGA adapter

Software note

• If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.

Accepted package(s)

BGA package

Usable for programmer(s):