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  • special adapter, assigned for eMMC devices in BGA package
  • designed for TurboMode
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) warranty of ZIF socket - 10,000 actuations at room temperature.
  • made in Slovakia
Ord. no. 70-2829A
Socket ZIF BGA169, OpenTop type
Bottom 4x25 pins, square, 0.6x0.6mm
Class BGA
Subclass BGA-Top
Availability in stock
0 pcs.

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other 5 pcs.

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within 3 working days ]
70-2829A

Price: US $869.00 [read this!]

Price 2-3: US $825.60

Price 4-7: US $799.50

Price 8+ : Ask for price [?]

Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:

    1. fixed discount when buying 4+ adapters of particular type,

    2. individual discount for quantities 8+ according to type of adapter and        demanded quantity. To get Quotation 8+ please click here: Ask for price

We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.

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Adapter manual

  • For work with BGA device it is necessary put together BGA-Top-302 ZIF (a) with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
  • The top cover must be fully actuated (depressed) before inserting a package into the socket.
  • Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane.
  • Do not push package while loading or releasing the lid.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
  • Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA11.11.2
Ball HeightA10.170.220.27
Body ThicknessA2---
Ball Diameterb0.250.30.35
Body SizeD17.91818.1
Body SizeE11.91212.1
Ball Pitche-0.5-
Ball Array DGD-28-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA--1.3
Ball HeightA10.180.220.26
Body ThicknessA2---
Ball Diameterb0.250.30.35
Body SizeD-18-
Body SizeE-12-
Ball Pitche-0.5-
Ball Array DGD-28-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.17--
Body ThicknessA20.810.911.01
Ball Diameterb-0.3-
Body SizeD17.851818.15
Body SizeE11.851212.15
Ball Pitche-0.5-
Ball Array DGD-28-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.180.220.26
Body ThicknessA2---
Ball Diameterb0.250.30.35
Body SizeD-18-
Body SizeE-12-
Ball Pitche-0.5-
Ball Array DGD-28-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.170.220.27
Body ThicknessA20.981.031.08
Ball Diameterb0.250.30.35
Body SizeD17.91818.1
Body SizeE11.931212.07
Ball Pitche-0.5-
Ball Array DGD-28-
Ball Array EGE-14-

Usable for programmer(s):

BeeHive208S BeeHive204 BeeProg2 BeeProg2C
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