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  • top board of BGA adapters
  • used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) warranty of ZIF socket - 10,000 actuations
  • supported from PG4UW software version 3.09b
  • made in Slovakia
Ord. no. 70-0369A
Socket ZIF BGA63, OpenTop type
Bottom 4x25 pins, square, 0.6x0.6mm
Class BGA
Subclass BGA-Top
Availability in stock
0 pcs.

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other 17 pcs.

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70-0369A

Price: US $451.00 [read this!]

Price 2-3: US $428.50

Price 4-7: US $414.90

Price 8+ : Ask for price [?]

Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:

    1. fixed discount when buying 4+ adapters of particular type,

    2. individual discount for quantities 8+ according to type of adapter and        demanded quantity. To get Quotation 8+ please click here: Ask for price

We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.

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Adapter manual

  • Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.
  • For work with BGA device it is necessary put together BGA-Top-X with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
  • The picture shows, how to put together the BGA-Top-X and BGA-Bottom-X board to have complete BGA adapter.
  • Insert complete adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer ZIF socket.
  • Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, insert the device into the socket. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  • Do not press on device while inserting it and/or releasing the cover.
  • Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
  • Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
  • Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer ZIF socket.
  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.270.320.37
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-

Usable for programmer(s):

BeeHive208S BeeHive204 BeeProg2 BeeProg2C
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