BeeProg2

 
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Discontinued product! Please go to discontinued products section to find the replacement.

  • 70-0417

  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) life of ZIF socket - 500,000 actuations
  • made in Slovakia
Ord. no. 70-0417
Socket ZIF BGA107 (depopulated array of (96) spring probes), ClamShell type
Connection to BGA-Bottom-X 4 rows, 4x 25 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Adapter manual
  • For work with BGA device it is necessary put together BGA-Top-51 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA107 Package
Design




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