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  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) warranty of ZIF socket - 10,000 actuations
  • made in Slovakia
Ord. no. 70-0466
Socket ZIF BGA56, OpenTop type
Bottom 4 rows, 4x 25 pins, square, 0.6x0.6mm
Class BGA
Subclass BGA-Top
Availability in stock
0 pcs.

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other 12 pcs.

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.

within 3 working days ]
70-0466

Price: US $341.00 [read this!]

Price 2-3: US $324.00

Price 4-7: US $313.70

Price 8+ : Ask for price [?]

Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:

    1. fixed discount when buying 4+ adapters of particular type,

    2. individual discount for quantities 8+ according to type of adapter and        demanded quantity. To get Quotation 8+ please click here: Ask for price

We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.

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Adapter manual

  • For work with BGA device it is necessary put together BGA-Top-57 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
  • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
  • Once fully actuated, drop the package into the socket from a height of 2 to 3mm above the seating plane.
  • Do not push package while loading or releasing the lid.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
  • Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.15--
Body ThicknessA2-0.665-
Ball Diameterb0.3250.3750.425
Body SizeD7.67.77.8
Body SizeE8.999.1
Ball Pitche-0.75-
Ball Array DGD-8-
Ball Array EGE-7-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.2--
Body ThicknessA2-0.66-
Ball Diameterb0.30.350.4
Body SizeD7.67.77.8
Body SizeE8.999.1
Ball Pitche-0.75-
Ball Array DGD-8-
Ball Array EGE-7-

Usable for programmer(s):

BeeHive208S BeeHive204 BeeProg2 BeeProg2C
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