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  • 70-0682
    Price: US $396.00 [read this!]
    Price 4-7: US $364.30
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  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) warranty of ZIF socket - 10,000 actuations
  • made in Slovakia
Ord. no. 70-0682
Socket ZIF BGA176 OpenTop type
Connection to BGA-Bottom-X 8+3 rows, 8x25+3x20 pins, square, 0.6x0.6mm
Subclass BGA-Top
Availability in stock 1 pcs.
Adapter manual
  • For work with BGA device it is necessary put together BGA-Top-92 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
  • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
  • Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
  • Check brochure - - for details on proper insertion procedure of chip/device into this ZIF socket.
  • Once fully actuated, drop the package into the socket from a height of 2 to 3mm above the seating plane and slightly press the device into ZIF socket.
  • The chip fit into ZIF socket very precise, therefore it right happen, the chip be shuck a bit into ZIF socket. Therefore we recoment to use the vacuum pen with large rubber cup. The suitable vacuum pen is attached to the BGA-Top-92 ZIF adapter delivery.
  • Do not push package while loading or releasing the lid.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
  • Notes to the BGA-Top-92 ZIF, S/N below 682-00008:
  • - after putting chip into ZIF socket, slightly press on the top of it to ensure proper position of chip into ZIF socket.
  • - use proper type of vacuum pen and enough big rubber cap (8mm diameter or above) for removing a chip from ZIF socket.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package Package
Ball HeightA10.350.40.45
Body ThicknessA2---
Ball Diameterb0.450.50.55
Body SizeD-13-
Body SizeE-13-
Ball Pitche-0.8-
Ball Array DGD-15-
Ball Array EGE-15-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
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