DIL48/BGA137-1 ZIF NAND-1 | Programming adapter

DIL48/BGA137-1 ZIF NAND-1
(Ord. no. 70-3113)

See: Adapter manual | Accepted package(s) | Usable for programmer(s) | List of supported devices

Price: US $798.00 [read this!]
Price 4-7: US $734.20
Price 8+ : Ask for price [?]

specialized adapter for NAND flash devices in package FBGA137 13x10.5x max. 1.4mm, pitch 0.8mm, matrix 15x10 designed for TurboMode used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s) operating (mechanical) warranty of ZIF socket – 10,000 actuations supported from PG4UW software version 3.08, s/n from 3113-00039 are supported from PG4UW software version 3.76 made in Slovakia
Ord. no.	70-3113
Socket	ZIF BGA137, OpenTop type
Bottom	2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class	Specialized
Subclass	Memory (NOR/NAND/eMMC)
Availability in stock	3 pcs. [other 1 pcs. This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 working days]

Adapter manual

Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
Usage of vacuum pick-up tool is expected for device handling.
Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.

Insert adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
Visually check the placement of adapter in programmer ZIF socket.
Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
The cover must be fully actuated (depressed) before inserting a device into the socket. If device is inserted into only partially opened ZIF socket, then - after releasing of cover - the tweezer contacts might bend and if repeated several times this way tweezer contacts might even break.
Do not press on device while inserting it and/or releasing the cover.
Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
When you finish the work with adapter, remove it from programmer ZIF socket.

Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note

If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.

Accepted package(s)

BGA package

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	1.2	1.3	1.4
Ball Height	A1	0.27	0.32	0.37
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.21	0.26	0.31
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	-	13	-
Body Size	E	-	10.5	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.4
Ball Height	A1	0.21	0.26	0.31
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	-	13	-
Body Size	E	-	10.5	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	1	1.1	1.2
Ball Height	A1	0.27	0.32	0.37
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	-	-
Body Thickness	A2	-	0.8	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.22	0.27	0.32
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.4
Ball Height	A1	0.25	-	-
Body Thickness	A2	-	1	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	-	-	-
Body Thickness	A2	0.8	0.85	0.9
Ball Diameter	b	-	0.45	-
Body Size	D	12.85	13	13.15
Body Size	E	10.35	10.5	10.65
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.1
Ball Height	A1	0.25	-	-
Body Thickness	A2	0.68	0.73	0.78
Ball Diameter	b	-	0.45	-
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	0.9	1	1.1
Ball Height	A1	0.25	-	-
Body Thickness	A2	-	-	-
Ball Diameter	b	-	0.45	-
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	-	-
Body Thickness	A2	0.75	0.85	0.95
Ball Diameter	b	-	0.45	-
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.22	0.26	0.3
Body Thickness	A2	-	-	-
Ball Diameter	b	0.41	0.46	0.51
Body Size	D	-	13	-
Body Size	E	-	10.5	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1.2
Ball Height	A1	0.25	-	0.4
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	1.03	1.13	1.2
Ball Height	A1	0.22	0.27	0.32
Body Thickness	A2	-	-	-
Ball Diameter	b	0.35	0.4	0.45
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1
Ball Height	A1	0.21	0.26	0.31
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	-	-	1
Ball Height	A1	0.21	0.26	0.31
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	-	13	-
Body Size	E	-	10.5	-
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	0.8	0.9	1
Ball Height	A1	0.27	0.32	0.37
Body Thickness	A2	-	-	-
Ball Diameter	b	0.4	0.45	0.5
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

NAME	SYMBOL	MIN	NOM	MAX
Profile	A	0.8	0.9	1
Ball Height	A1	0.25	-	-
Body Thickness	A2	-	-	-
Ball Diameter	b	-	0.45	-
Body Size	D	12.9	13	13.1
Body Size	E	10.4	10.5	10.6
Ball Pitch	e	-	0.8	-
Ball Array D	GD	-	15	-
Ball Array E	GE	-	10	-

Usable for programmer(s):

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.

We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.

DIL48/BGA137-1 ZIF NAND-1
(Ord. no. 70-3113)

Adapter manual

Software note

Accepted package(s)

Usable for programmer(s):

Universal

Specialized for

BGA/LGA

exhibitions


	? Device Search tip The names of the programmable devices in our database don't contain all characters, shown at the top of the chip or mentioned in a datasheet section part numbering. The names of the chips in our database contain all characters necessary for identification of the device, but don't contain such codes, that have no influence to the programming, for example temperature code, speed code, packing type code, etc. . If such code letter is at the end of the name, it should be omitted. Example: devices Am27C512-150, Am27C512-200 and Am27C512-250 should be searched as Am27C512
Home Products Universal programmers » BeeProg3 BeeProg2 BeeProg2AP BeeProg2C SmartProg2 Production programmers » BeeHive208S BeeHive304 BeeHive204 BeeHive204AP BeeProg3 BeeProg2AP BeeProg3 and BeeProg2/BeeProg2C multiprogramming Programming adapters AP1 programming modules AP3 programming modules Software Accessories Discontinued products Support AlgOR (New device support) Download (SW, documentation) Application notes Problem report Technical support Product registration List of supported devices « Services Programmer calibration Warranty & After-warranty repairs Keep-Current service « Other IC logos Links Undeliverable responses About Elnec Contacts Company info News Exhibitions Careers Distributors

DIL48/BGA137-1 ZIF NAND-1(Ord. no. 70-3113)

Adapter manual

Software note

Accepted package(s)

Usable for programmer(s):

Universal

Specialized for

BGA/LGA

exhibitions

DIL48/BGA137-1 ZIF NAND-1
(Ord. no. 70-3113)