BeeProg2

 
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DIL48/BGA168-1 ZIF NAND-1
(Ord. no. 70-3265)

See: Adapter manual | Accepted package(s) | Usable for programmer(s) | List of supported devices
  • 70-3265
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  • specialized adapter for MCP NAND flash devices in package BGA168 12x12x max. 1.1mm, pitch 0.5mm, matrix 23x23-19x19
  • designed for TurboMode
  • used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) life of ZIF socket – 10,000 actuations
  • supported from PG4UW software version 3.09l
  • made in Slovakia
Ord. no. 70-3265
Socket ZIF BGA168, OpenTop type
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class Specialized
Subclass Memory (NOR/NAND/eMMC)
Availability in stock 0 We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.pcs.
Adapter manual
  • Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.

  • Insert adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer ZIF socket.
  • Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer ZIF socket.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.1
Ball HeightA10.25--
Body ThicknessA20.650.750.85
Ball Diameterb-0.33-
Body SizeD11.91212.1
Body SizeE11.91212.1
Ball Pitche-0.5-
Ball Array DGD-23-
Ball Array EGE-23-
NAMESYMBOLMINNOMMAX
ProfileA--0.9
Ball HeightA10.25--
Body ThicknessA20.50.60.7
Ball Diameterb-0.33-
Body SizeD11.91212.1
Body SizeE11.91212.1
Ball Pitche-0.5-
Ball Array DGD-23-
Ball Array EGE-23-
NAMESYMBOLMINNOMMAX
ProfileA--0.9
Ball HeightA10.23--
Body ThicknessA2-0.58-
Ball Diameterb0.280.330.38
Body SizeD11.91212.1
Body SizeE11.91212.1
Ball Pitche-0.5-
Ball Array DGD-23-
Ball Array EGE-23-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.2510.2550.259
Body ThicknessA2---
Ball Diameterb0.290.340.39
Body SizeD-12-
Body SizeE-12-
Ball Pitche-0.5-
Ball Array DGD-23-
Ball Array EGE-23-
NAMESYMBOLMINNOMMAX
ProfileA--0.9
Ball HeightA10.23--
Body ThicknessA20.530.580.63
Ball Diameterb-0.34-
Body SizeD11.91212.1
Body SizeE11.91212.1
Ball Pitche-0.5-
Ball Array DGD-23-
Ball Array EGE-23-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.23--
Body ThicknessA20.630.680.73
Ball Diameterb-0.34-
Body SizeD11.91212.1
Body SizeE11.91212.1
Ball Pitche-0.5-
Ball Array DGD-23-
Ball Array EGE-23-
NAMESYMBOLMINNOMMAX
ProfileA--0.75
Ball HeightA10.23--
Body ThicknessA20.380.430.48
Ball Diameterb-0.34-
Body SizeD11.91212.1
Body SizeE11.91212.1
Ball Pitche-0.5-
Ball Array DGD-23-
Ball Array EGE-23-
NAMESYMBOLMINNOMMAX
ProfileA--0.9
Ball HeightA10.210.260.31
Body ThicknessA2---
Ball Diameterb0.280.330.38
Body SizeD11.91212.1
Body SizeE11.91212.1
Ball Pitche-0.5-
Ball Array DGD-23-
Ball Array EGE-23-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+ BeeHive8S BeeHive4+



This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.