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  • specialized adapter for Toshiba NAND Flash devices in package BGA63 11x9mm, pitch 0.8mm and low height balls
  • used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) warranty of ZIF socket – 10,000 actuations
  • supported from PG4UW software version 3.37a,
    s/n from 4457-00248 are supported from PG4UW software version 3.76
  • made in Slovakia
Ord. no. 70-4457
Socket ZIF BGA63, OpenTop type
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class Specialized
Subclass Memory (NOR/NAND/eMMC)
Availability in stock
3 pcs.
[
other 45 pcs.

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.

within 3 working days ]
70-4457

Price: US $546.00 [read this!]

Price 2-3: US $518.70

Price 4-7: US $502.30

Price 8+ : Ask for price [?]

Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:

    1. fixed discount when buying 4+ adapters of particular type,

    2. individual discount for quantities 8+ according to type of adapter and        demanded quantity. To get Quotation 8+ please click here: Ask for price

We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.

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Adapter manual

  • Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.
  • Insert adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer ZIF socket.
  • Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  • Do not press on device while inserting it and/or releasing the cover.
  • Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
  • Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
  • Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer ZIF socket.
  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.410.460.51
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-

Usable for programmer(s):

BeeHive208S BeeHive204 BeeProg2 BeeProg2C
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