BeeProg2

 
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DIL48/BGA63-1 ZIF NAND-1
(Ord. no. 70-3105)

See: Adapter manual | Accepted package(s) | Usable for programmer(s) | List of supported devices
  • 70-3105

    Price: US $496.00 [read this!][read this!])
    Price 4-7: US $456.30
    Price 8+ : Ask for price [?]

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  • specialized adapter for NAND flash devices in package BGA63 11x9mm, pitch 0.8mm
  • designed for TurboMode
  • used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) life of ZIF socket – 10,000 actuations
  • supported from PG4UW software version 3.04f
  • made in Slovakia
Ord. no. 70-3105
Socket ZIF BGA63, OpenTop type
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class Specialized
Subclass Memory (NOR/NAND/eMMC)
Availability in stock 46 pcs. [other 3 pcs. This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 days]
Adapter manual
  • Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.

  • Insert adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer ZIF socket.
  • Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket. If device is inserted into only partially opened ZIF socket, then - after releasing of cover - the tweezer contacts might bend and if repeated several times this way tweezer contacts might even break.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer ZIF socket.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.270.320.37
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD8.999.1
Body SizeE6.977.1
Ball Pitche-0.8-
Ball Array DGD-10-
Ball Array EGE-8-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.270.320.37
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.250.30.35
Body ThicknessA20.550.60.65
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.05
Ball HeightA10.25--
Body ThicknessA2--0.7
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.05
Ball HeightA10.25--
Body ThicknessA2-0.65-
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25-0.35
Body ThicknessA2-0.6-
Ball Diameterb0.4-0.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA20.60.650.7
Ball Diameterb-0.45-
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb-0.45-
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.410.460.51
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.250.30.35
Body ThicknessA20.59-0.74
Ball Diameterb0.40.450.5
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+ BeeHive8S BeeHive4+



This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
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