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Ord. no. | 70-6014 |
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Socket | ZIF BGA20, ClamShell type |
Bottom | 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil |
Class | Specialized |
Subclass | ARM |
Availability in stock |
1 pcs.
[ other 1 pcs. within 3 working days ]
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
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Unit pricing strongly depends on quantity:
Price 1 pc : US $875.00
Price 2 pcs: US $672.90
Price 3 pcs: US $614.20
show morePrice 4 pcs: US $569.20
Price 5 pcs: US $551.60
Price 6 pcs: US $539.80
Price 7 pcs: US $531.40
Price 8+ : Ask for price
Adapter manual
- Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
- Usage of vacuum pick-up tool is expected for device handling.
- Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.
- Insert adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
- Visually check the placement of adapter in programmer ZIF socket.
- Release the pawl on adapter ZIF socket to open it. The socket cap will open by spring force. Insert the device into adapter ZIF socket. The correct position of the programmed device is shown on PCB of the adapter. The reference corner (e.g. position of pin A1) of the device is indicated by dot, by number 1, by bevelled corner or by any combination of mentioned.
- Visually check the placement of programmed device in adapter ZIF socket. If it looks OK, close adapter ZIF socket cap by hand and secure the pawl.
- To take out the device from adapter, release the pawl on adapter ZIF socket and remove the device.
- When you finish the work with adapter, remove it from programmer ZIF socket.
- Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package | |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | 0.55 | 0.6 | 0.65 |
Ball Height | A1 | 0.21 | 0.24 | 0.27 |
Body Thickness | A2 | 0.34 | 0.36 | 0.38 |
Ball Diameter | b | 0.29 | 0.32 | 0.35 |
Body Size | D | 2.5 | 2.55 | 2.6 |
Body Size | E | 2.5 | 2.55 | 2.6 |
Ball Pitch | e | - | 0.5 | - |
Ball Array D | GD | - | 5 | - |
Ball Array E | GE | - | 4 | - |