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  • specialized programming module for STMicroelectronics STM32 devices in BGA100 package (ball matrix 12x12)
  • used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) warranty of ZIF socket - 10,000 actuations
  • supported from PG4UW software version 3.81g
  • made in Slovakia
Ord. no. 71-4311
Socket ZIF BGA144, OpenTop type
Bottom 2 female connectors by 32 pins, DIN41612 B/2
Class Specialized
Subclass ST MCU
Availability in stock
12 pcs.

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.

within 3 working days
71-4311

Price: US $495.00 [read this!]

Price 2-3: US $470.30

Price 4-7: US $455.40

Price 8+ : Ask for price [?]

Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:

    1. fixed discount when buying 4+ adapters of particular type,

    2. individual discount for quantities 8+ according to type of adapter and        demanded quantity. To get Quotation 8+ please click here: Ask for price

We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.

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Module manual

  • Programmer don"t need to be switched off and SW can be running during inserting/removing programming module
  • Protect the contacts of module connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Proceed with care! Incorrect insertion of device in module ZIF socket may lead to programmed device damage.
  • Unscrew 2 knurled thumb screws. Insert programming module into Programming Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programming Module Interface connectors is possible. Screw 2 knurled thumb screws to fix programming module to programmer.
  • Push the cover of module ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. The correct position of the programmed device is shown on PCB of the module. The reference corner (e.g. position of pin A1) of the device is indicated by dot, by number 1, by bevelled corner or by any combination of mentioned. Then release module ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in module ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from module, push the cover of module ZIF socket and remove the device.
  • When you finish the work with module, unscrew 2 knurled thumb screws and remove the module from Programming Module Interface connectors.
  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 
 

Accepted package(s)

BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA0.460.530.6
Ball HeightA10.060.080.1
Body ThicknessA20.40.450.5
Ball Diameterb0.20.250.3
Body SizeD-7-
Body SizeE-7-
Ball Pitche-0.5-
Ball Array DGD-12-
Ball Array EGE-12-
NAMESYMBOLMINNOMMAX
ProfileA0.460.530.6
Ball HeightA10.050.080.11
Body ThicknessA20.40.450.5
Ball Diameterb0.20.250.3
Body SizeD6.9577.05
Body SizeE6.9577.05
Ball Pitche-0.5-
Ball Array DGD-12-
Ball Array EGE-12-
NAMESYMBOLMINNOMMAX
ProfileA--0.6
Ball HeightA1--0.11
Body ThicknessA2-0.45-
Ball Diameterb0.240.290.34
Body SizeD6.8577.15
Body SizeE6.8577.15
Ball Pitche-0.5-
Ball Array DGD-12-
Ball Array EGE-12-
NAMESYMBOLMINNOMMAX
ProfileA-0.740.84
Ball HeightA10.110.160.21
Body ThicknessA2-0.58-
Ball Diameterb0.20.250.3
Body SizeD6.977.1
Body SizeE6.977.1
Ball Pitche-0.5-
Ball Array DGD-12-
Ball Array EGE-12-

Usable for programmer(s):

BeeHive204AP BeeProg2AP
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