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AP3 BGA63-1.13 CS NAND-1
(Ord. no. 73-4250)

See: Module manual | Accepted package(s) | Useable for programmer(s) | List of supported devices
  • 73-4250
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  • specialized programming module for NAND flash devices in BGA63 package 11x9x max 1.2mm, pitch 0.8mm, grid 12x10
  • used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) warranty of ZIF socket – 500,000 actuations
  • supported from PG4UW software version 3.31
  • made in Slovakia
Ord. no. 73-4250
Socket ZIF BGA63, ClamShell type
Bottom 2 connectors by 68 pins, receptacle type
Class Specialized
Subclass Memory (NOR/NAND/eMMC)
Availability in stock 0 We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.pcs. [other 1 pcs. This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 days]
Module manual
  • Programmer don't need to be switched off and SW can be running during inserting/removing programming module
  • Protect the contacts of module connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Proceed with care! Incorrect insertion of device in module ZIF socket may lead to programmed device damage.

  • Unscrew knurled thumb screw. Insert programming module into Programming Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programming Module Interface connectors is possible. Screw knurled thumb screw to fix programming module to programmer.
  • Release the pawl on module ZIF socket to open it. The socket cap will open by spring force. Insert the device into module ZIF socket. The correct position of the programmed device is shown on PCB of the module. The reference corner (position of pin A1) of the device is indicated by dot.
  • Visually check the placement of programmed device in module ZIF socket. If it looks OK, close module ZIF socket cap by hand and secure the pawl.
  • To take out the device from module, release the pawl on module ZIF socket and remove the device.
  • When you finish the work with module, unscrew knurled thumb screw and remove the module from Programming Module Interface connectors.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing

Software note
  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.270.320.37
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.250.30.35
Body ThicknessA20.550.60.65
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.250.30.4
Body ThicknessA20.55--
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.05
Ball HeightA10.25--
Body ThicknessA2--0.7
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.05
Ball HeightA10.25--
Body ThicknessA2-0.65-
Ball Diameterb0.40.450.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25-0.35
Body ThicknessA2-0.6-
Ball Diameterb0.4-0.5
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA20.60.650.7
Ball Diameterb-0.45-
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb-0.45-
Body SizeD10.91111.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.410.460.51
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.250.30.35
Body ThicknessA20.59-0.74
Ball Diameterb0.40.450.5
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD-11-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-




This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.