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AP3 LGA52-6 module 3D Plus NAND-1
(Ord. no. 73-4768)

See: Module manual | Accepted package(s) | Useable for programmer(s) | List of supported devices
  • 73-4768
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  • specialized programming module for NAND flash modules from 3D Plus in LGA52 package
  • designed for TurboMode
  • used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) warranty of ZIF socket – 10,000 actuations
  • supported from PG4UW software version 3.40r
  • made in Slovakia
Ord. no. 73-4768
Socket ZIF LGA52, FastLock type
Bottom 2 connectors by 68 pins, receptacle type
Class Specialized
Subclass Memory (NOR/NAND/eMMC)
Availability in stock 0 We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.pcs.
Module manual
  • Programmer don't need to be switched off and SW can be running during inserting/removing programming module
  • Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.

  • Unscrew knurled thumb screw. Insert programming module into Programming Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programming Module Interface connectors is possible. Screw knurled thumb screw to fix programming module to programmer.
  • For detail user instructions how use this ZIF please check this pdf.
  • Open adapter ZIF socket. Insert the device into the adapter ZIF socket. The right position of the programmed device in adapter ZIF socket is show at picture near (mainly left above) the adapter ZIF socket. On this picture reference corner (e.g. position of pin 1) of device is indicated by dot, by number 1, by bevelled corner or by any combination of them.
  • Visually check interconnection between device and adapter ZIF socket. If everything looks OK, close socket, and the device is ready for programming.
  • When you finish the work with module, unscrew knurled thumb screw and remove the module from Programming Module Interface connectors.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing

Software note
  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package Package
Ball HeightA1---
Body ThicknessA2--2
Ball Diameterb0.7-1
Body SizeD18.5518.718.85
Body SizeE14.5514.714.85
Ball Pitche-1-
Ball Array DGD-19-
Ball Array EGE-9-

Useable for programmer(s):
BeeHive304 BeeProg3

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 4 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.