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AP3 TSOP58 module 3D Plus NAND-1
(Ord. no. 73-3730)

See: Module manual | Accepted package(s) | Useable for programmer(s) | List of supported devices
  • 73-3730
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  • specialized programming module for 3D Plus NAND flash modules in SOP58 package
  • operating (mechanical) warranty of ZIF socket – 10,000 actuations
  • supported from PG4UW software version 3.32v
  • made in Slovakia
Ord. no. 73-3730
Socket ZIF SOP58, FastLock type
Bottom 2 connectors by 68 pins, receptacle type
Class Specialized
Subclass Memory (NOR/NAND/eMMC)
Availability in stock 0 We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.pcs.
Module manual
  • Programmer don't need to be switched off and SW can be running during inserting/removing programming module
  • Protect the contacts of module connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Proceed with care! Incorrect insertion of device in module ZIF socket may lead to programmed device damage.

  • Unscrew knurled thumb screw. Insert programming module into Programming Module Interface connectors, until it clicks. Due to connectors shape, only one orientation and position of programming module in Programming Module Interface connectors is possible. Screw knurled thumb screw to fix programming module to programmer.
  • Press two pawls on module ZIF socket lid to release it. Lift up the lid and take it away.
  • Insert the device into module ZIF socket base so that device pins were sunk into contact grooves. Facing the module in legend readable position, device pin 1 should head towards top left and module body should be aligned down (towards you).
  • Visually check the placement of programmed device in module ZIF socket. If it looks OK, put module ZIF socket lid on carefully and secure the pawls.
  • To take out the device from module, press the pawls on module ZIF socket lid, lift it up and remove the device.
  • When you finish the work with module, unscrew knurled thumb screw and remove the module from Programming Module Interface connectors.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing

Software note
  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
SOP58 Package
SOP58 Package

Useable for programmer(s):
BeeHive304 BeeProg3

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 4 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.