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Discontinued product! Please go to discontinued products section to find the replacement.

  • bottom board of BGA adapters, assigned for eMMC devices in matrix 11x8+4x3 for example NAND16GAHAP, MTFC4GGQDQ
  • made in Slovakia
Ord. no. 70-2249
Socket 4x25 sockets for wire wrap pin
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class BGA
Subclass BGA-Bottom

Adapter manual

  • For work with BGA device it is necessary put together BGA-Bottom-243 with some BGA-Top-X ZIF-CS board according the information provided by PG4UW software.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note

  • If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
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