Discontinued product! Please go to discontinued products section to find the replacement.
- top board of BGA adapters
- ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
- The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
- operating (mechanical) warranty of ZIF socket - 10,000 actuations
- NOTE: in case of programming adapter identify error, please use PG4UW software version 3.82 and newer (see application note AN-IDX)
- made in Slovakia
|
| Ord. no. | 70-1182 |
| Socket | ZIF BGA256, OpenTop type |
| Connection to BGA-Bottom-X | 8x25 + 3x20 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-223 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane.
- Do not push package while loading or releasing the lid.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
- Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.7 |
| Ball Height | A1 | 0.25 | - | - |
| Body Thickness | A2 | 0.65 | - | - |
| Ball Diameter | b | 0.4 | 0.45 | 0.5 |
| Body Size | D | - | 14 | - |
| Body Size | E | - | 14 | - |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 16 | - |
| Ball Array E | GE | - | 16 | - | |
Usable for programmer(s):
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
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