Discontinued product! Please go to discontinued products section to find the replacement.
- top board of BGA adapters
- used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
- operating (mechanical) warranty of ZIF socket - 10,000 actuations
- supported from PG4UW software version 3.22r,
s/n from 3803-00162 are supported from PG4UW software version 3.76 - made in Slovakia
|
| Ord. no. | 70-3803 |
| Socket | ZIF BGA400, OpenTop type |
| Connection to BGA-Bottom-X | 8x50 + 2x50 pins, B-T-B connector, pitch 0.8mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
Adapter manual
- Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
- Usage of vacuum pick-up tool is expected for device handling.
- Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.
- For work with BGA device it is necessary put together BGA-Top-X with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The picture shows, how to put together the BGA-Top-X and BGA-Bottom-X board to have complete BGA adapter.
- Insert complete adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
- Visually check the placement of adapter in programmer ZIF socket.
- Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
- The cover must be fully actuated (depressed) before inserting a device into the socket.
- Do not press on device while inserting it and/or releasing the cover.
- Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
- Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
- Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
- To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
- When you finish the work with adapter, remove it from programmer ZIF socket.
- Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.7 |
| Ball Height | A1 | 0.25 | 0.35 | - |
| Body Thickness | A2 | 0.8 | 1 | - |
| Ball Diameter | b | 0.4 | 0.45 | 0.5 |
| Body Size | D | - | 17 | - |
| Body Size | E | - | 17 | - |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 20 | - |
| Ball Array E | GE | - | 20 | - | |
Usable for programmer(s):
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.
