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| Ord. no. | 70-4130 |
|---|---|
| Socket | ZIF BGA337, OpenTop type |
| Bottom | 2x25 pins, square, 0.6x0.6mm |
| Class | BGA |
| Subclass | BGA-Top |
| Availability in stock |
0 pcs.
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Unit pricing strongly depends on quantity:
Price 1 pc : US $1243.00
Price 2 pcs: US $799.70
Price 3 pcs: US $658.50
show morePrice 4 pcs: US $576.10
Price 5 pcs: US $533.70
Price 6 pcs: US $505.50
Price 7 pcs: US $485.30
Price 8+ : Ask for price
Adapter manual
- Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
- Usage of vacuum pick-up tool is expected for device handling.
- Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.
- For work with BGA device it is necessary put together BGA-Top-X with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The picture shows, how to put together the BGA-Top-X and BGA-Bottom-X board to have complete BGA adapter.
- Insert complete adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
- Visually check the placement of adapter in programmer ZIF socket.
- Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. The correct position of the programmed device is shown on PCB of the module. The reference corner (e.g. position of pin A1) of the device is indicated by dot, by number 1, by bevelled corner or by any combination of mentioned. Then release adapter ZIF socket.
- The cover must be fully actuated (depressed) before inserting a device into the socket.
- Do not press on device while inserting it and/or releasing the cover.
- Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
- Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
- To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
- When you finish the work with adapter, remove it from programmer ZIF socket.
- Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | 1.19 | - | 1.4 |
| Ball Height | A1 | 0.35 | - | 0.45 |
| Body Thickness | A2 | 0.84 | - | 0.95 |
| Ball Diameter | b | 0.45 | - | 0.55 |
| Body Size | D | 15.9 | 16 | 16.1 |
| Body Size | E | 15.9 | 16 | 16.1 |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 19 | - |
| Ball Array E | GE | - | 19 | - |
