BeeProg2

 
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  • 70-4126

    Price: US $490.00 [read this!][read this!])
    Price 4-7: US $450.80
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  • top board of BGA adapters
  • used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) life of ZIF socket - 10,000 actuations
  • supported from PG4UW software version 3.26t
  • made in Slovakia
Ord. no. 70-4126
Socket ZIF BGA133, OpenTop type
Connection to BGA-Bottom-X 8x25 + 3x20 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Availability in stock 6 pcs. [other 12 pcs. This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 days]
Adapter manual
  • Protect the contacts of adapters's connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.

  • For work with BGA device it is necessary put together BGA-Top-X with some BGA-Bottom-X board according to the information provided by PG4UW software.
  • The picture shows, how to put together the BGA-Top-X and BGA-Bottom-X board to have complete BGA adapter.

  • Insert complete adapter into programmer's ZIF socket. If you are in doubts about orientation of the adapter in programmer's ZIF socket, there is a rule of thumb - orientation of adapter's name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer's ZIF socket.
  • Push the cover of adapter's ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter's ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in adapter's ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter's ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer's ZIF socket.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA0.911.1
Ball HeightA10.20.250.3
Body ThicknessA20.70.760.82
Ball Diameterb0.250.30.35
Body SizeD7.988.1
Body SizeE7.988.1
Ball Pitche-0.5-
Ball Array DGD-14-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA0.80.91
Ball HeightA10.180.230.28
Body ThicknessA2---
Ball Diameterb0.250.30.35
Body SizeD7.988.1
Body SizeE7.988.1
Ball Pitche-0.5-
Ball Array DGD-14-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.15--
Body ThicknessA2-0.74-
Ball Diameterb0.2680.3180.368
Body SizeD7.988.1
Body SizeE7.988.1
Ball Pitche-0.5-
Ball Array DGD-14-
Ball Array EGE-14-
NAMESYMBOLMINNOMMAX
ProfileA0.91.231.35
Ball HeightA10.15--
Body ThicknessA2--1.1
Ball Diameterb0.250.30.35
Body SizeD-8-
Body SizeE-8-
Ball Pitche-0.5-
Ball Array DGD-14-
Ball Array EGE-14-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+ BeeHive8S BeeHive4+ BeeHive4
BeeProg JetProg (DIL48, ISP)



This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.

Universal

Specialized for

BGA/LGA

exhibitions

okraj

NEPCON China 2017

25th - 27th Apr 2017
Shanghai World Expo Exhibition & Convention Center
hall no.: Hall 1
booth no.: 1N07
exhibitor: Programtek

Del Mar Electronics Fair

3rd - 4th May 2017
Del Mar Fairgrounds, San Diego, CA, USA
booth no.: Booth #5
exhibitor: BK Precision

All exhibitions »