BeeProg2

 
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  • 70-0621

    Price: US $360.00 [read this!][read this!])
    Price 4-7: US $331.20
    Price 8+ : Ask for price [?]

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  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) life of ZIF socket - 10,000 actuations
  • made in Slovakia
Ord. no. 70-0621
Socket ZIF BGA48 (accept package up to 72 balls), OpenTop type
Connection to BGA-Bottom-X 8x25 + 3x20 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Availability in stock 0 We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.pcs. [other 5 pcs. This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 days]
Adapter manual
  • For work with BGA device it is necessary put together BGA-Top-46 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software.
  • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
  • Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane.
  • Do not push package while loading or releasing the lid.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

See this brochure for details on proper package loading procedure

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.1--
Body ThicknessA21.11-1.26
Ball Diameterb0.350.40.45
Body SizeD-12-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-14-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.17--
Body ThicknessA20.81-0.97
Ball Diameterb0.350.40.45
Body SizeD-12-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.17--
Body ThicknessA20.81-0.94
Ball Diameterb0.350.40.45
Body SizeD-12-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-12-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.17--
Body ThicknessA20.81-0.97
Ball Diameterb0.350.40.45
Body SizeD-12-
Body SizeE-9-
Ball Pitche-0.8-
Ball Array DGD-14-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA11.11.2
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.410.460.51
Body SizeD11.91212.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-14-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA11.11.2
Ball HeightA10.220.260.3
Body ThicknessA2---
Ball Diameterb0.30.350.4
Body SizeD11.91212.1
Body SizeE8.999.1
Ball Pitche-0.8-
Ball Array DGD-14-
Ball Array EGE-10-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+ BeeHive8S BeeHive4+



This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.