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DIL48/TFBGA232 ZIF-CS MT-AP00300
(Ord. no. 70-3668)

See: Adapter manual | Accepted package(s) | Usable for programmer(s) | List of supported devices
  • 70-3668
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  • specialized adapter for MTK MT-AP00300 devices in TFBGA232 package
  • used ZIF socket may accept one or more variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) life of ZIF socket – 250,000 actuations
  • supported from PG4UW software version 3.20u
  • made in Slovakia
Ord. no. 70-3668
Socket ZIF BGA232, ClamShell type
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class Specialized
Subclass other
Availability in stock 0 We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.pcs.
Adapter manual
  • Protect the contacts of adapters's connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer's ZIF socket or device in adapter's ZIF socket may lead to programmed device damage.

  • Insert adapter into programmer's ZIF socket. If you are in doubts about orientation of the adapter in programmer's ZIF socket, there is a rule of thumb - orientation of adapter's name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer's ZIF socket.
  • Release the pawl on adapter's ZIF socket to open it. The socket cap will open by spring force. Insert the device into adapter's ZIF socket. The correct position of the programmed device in adapter BGA ZIF socket is shown inside ZIF socket of the adapter. The reference corner (position of pin A1) of the device is indicated by triangle.
  • Visually check the placement of programmed device in adapter's ZIF socket. If it looks OK, close adapter's ZIF socket cap by hand and secure the pawl.
  • To take out the device from adapter, release the pawl on adapter's ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer's ZIF socket.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.2
Ball HeightA10.160.210.26
Body ThicknessA20.80.860.92
Ball Diameterb0.250.30.35
Body SizeD10.310.410.5
Body SizeE10.310.410.5
Ball Pitche-0.65-
Ball Array DGD-16-
Ball Array EGE-16-




This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.

Universal

Specialized for

BGA/LGA

exhibitions

okraj

NEPCON China 2017

25th - 27th Apr 2017
Shanghai World Expo Exhibition & Convention Center
hall no.: Hall 1
booth no.: 1N07
exhibitor: Programtek

Del Mar Electronics Fair

3rd - 4th May 2017
Del Mar Fairgrounds, San Diego, CA, USA
booth no.: Booth #5
exhibitor: BK Precision

All exhibitions »