BeeProg2

 
For the proper functioning of this website we recommend to turn on JavaScript.
 

  • 70-0955

    Price: US $598.00 [read this!][read this!])
    Price 4-7: US $568.10
    Price 8+ : Ask for price [?]

      View cart

  • top board of BGA adapters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operating (mechanical) warranty of ZIF socket - 10,000 actuations
  • made in Slovakia
Ord. no. 70-0955
Socket ZIF BGA484, OpenTop type
Connection to BGA-Bottom-X 8x50+2x50 pins, B-T-B connector, pitch 0.8mm
Class BGA/LGA
Subclass BGA-Top
Availability in stock 1 pcs. [other 6 pcs. This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 days]
Adapter manual
  • For work with BGA device it is necessary put together BGA-Top-119 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software.
  • The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
  • Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane.
  • Do not push package while loading or releasing the lid.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
  • Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
  • The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
  • Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--2.5
Ball HeightA10.40.50.6
Body ThicknessA2---
Ball Diameterb0.50.60.7
Body SizeD-23-
Body SizeE-23-
Ball Pitche-1-
Ball Array DGD-22-
Ball Array EGE-22-
NAMESYMBOLMINNOMMAX
ProfileA22.22.6
Ball HeightA10.350.50.6
Body ThicknessA2---
Ball Diameterb0.50.60.7
Body SizeD-23-
Body SizeE-23-
Ball Pitche-1-
Ball Array DGD-22-
Ball Array EGE-22-
NAMESYMBOLMINNOMMAX
ProfileA1.72.152.6
Ball HeightA10.30.50.7
Body ThicknessA2---
Ball Diameterb0.50.60.7
Body SizeD-23-
Body SizeE-23-
Ball Pitche-1-
Ball Array DGD-22-
Ball Array EGE-22-
NAMESYMBOLMINNOMMAX
ProfileA1.72.152.6
Ball HeightA10.30.50.7
Body ThicknessA2---
Ball Diameterb0.50.60.7
Body SizeD-23-
Body SizeE-23-
Ball Pitche-1-
Ball Array DGD-22-
Ball Array EGE-22-
NAMESYMBOLMINNOMMAX
ProfileA2.022.232.44
Ball HeightA10.40.50.6
Body ThicknessA21.621.731.84
Ball Diameterb0.50.630.7
Body SizeD22.82323.2
Body SizeE22.82323.2
Ball Pitche-1-
Ball Array DGD-22-
Ball Array EGE-22-
NAMESYMBOLMINNOMMAX
ProfileA1.631.832.03
Ball HeightA10.40.50.6
Body ThicknessA2-1.33-
Ball Diameterb0.50.60.7
Body SizeD22.92323.1
Body SizeE22.92323.1
Ball Pitche-1-
Ball Array DGD-22-
Ball Array EGE-22-

Usable for programmer(s):
BeeHive208S BeeHive204 BeeProg2 BeeProg2C BeeProg+ BeeHive8S BeeHive4+

This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.

Universal

Specialized for

BGA/LGA

exhibitions

okraj

IFAM 2020

11th - 13th Feb 2020
Ljubljana Exhibition and Convention Centre
hall no.: Hall C
booth no.: 105
exhibitor: AX elektronika d.o.o.

NEPCON China 2020

22nd - 24th Apr 2020
Shanghai World Expo Exhibition & Convention Center
booth no.: 2Q01
exhibitor: Prosystems

All exhibitions »