|
|
| Ord. no. | 70-2141 |
|---|---|
| Socket | ZIF BGA16, ClamShell type |
| Bottom | 8x25 + 3x20 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock |
1 pcs.
[ other 1 pcs. within 3 working days ]
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
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Adapter manual
- For work with BGA device it is necessary put together BGA-Top-249 ZIF-CS with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 0.6 |
| Ball Height | A1 | 0.05 | 0.1 | 0.15 |
| Body Thickness | A2 | - | 0.43 | - |
| Ball Diameter | b | 0.25 | 0.3 | 0.35 |
| Body Size | D | 2.9 | 3 | 3.1 |
| Body Size | E | 2.9 | 3 | 3.1 |
| Ball Pitch | e | - | 0.65 | - |
| Ball Array D | GD | - | 4 | - |
| Ball Array E | GE | - | 4 | - |
