Discontinued product! Please go to discontinued products section to find the replacement.
- top board of BGA adapters
- ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
- The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
- operating (mechanical) warranty of ZIF socket - 10,000 actuations
- made in Slovakia
|
Ord. no. | 70-2672 |
Socket | ZIF BGA176, OpenTop type |
Connection to BGA-Bottom-X | 8x25 + 3x20 pins, square, 0.6x0.6mm |
Class | BGA/LGA |
Subclass | BGA-Top |
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-286 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
- Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.

Software note
- If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package |
 |
 |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | - | - | 1.4 |
Ball Height | A1 | 0.35 | 0.4 | 0.45 |
Body Thickness | A2 | - | - | - |
Ball Diameter | b | 0.45 | 0.5 | 0.55 |
Body Size | D | - | 13 | - |
Body Size | E | - | 13 | - |
Ball Pitch | e | - | 0.8 | - |
Ball Array D | GD | - | 15 | - |
Ball Array E | GE | - | 15 | - | |
Usable for programmer(s):
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
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