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distributor for your country - listed in our web site.
Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:
- fixed discount when buying 4+ adapters of particular type,
- individual discount for quantities 8+ according to type of adapter and demanded quantity. To get Quotation 8+ please click here: Ask for price
- top board of BGA adapters
- ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
- The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
- operating (mechanical) warranty of ZIF socket - 10,000 actuations
- NOTE: in case of programming adapter identify error, please use PG4UW software version 3.82 and newer (see application note AN-IDX)
- made in Slovakia
|
| Ord. no. | 70-2713 |
| Socket | ZIF BGA60, OpenTop type |
| Connection to BGA-Bottom-X | 4x25 pins, square, 0.6x0.6mm |
| Class | BGA/LGA |
| Subclass | BGA-Top |
| Availability in stock | 1 pcs. [other 6 pcs.
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. within 3 working days] |
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-292 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- Check this brochure for details on proper insertion procedure of chip/device into this ZIF socket.
- Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
- The picture show, how to put together the BGA-Top-X ZIF and BGA-Bottom-X boards to have complete BGA adapter
Software note
- If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |
 |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | 0.8 | 0.9 | 1 |
| Ball Height | A1 | 0.2 | - | - |
| Body Thickness | A2 | - | - | - |
| Ball Diameter | b | - | 0.375 | - |
| Body Size | D | 8.9 | 9 | 9.1 |
| Body Size | E | 6.9 | 7 | 7.1 |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 8 | - |
| Ball Array E | GE | - | 8 | - | |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1 |
| Ball Height | A1 | 0.17 | - | - |
| Body Thickness | A2 | - | - | - |
| Ball Diameter | b | 0.35 | 0.4 | 0.45 |
| Body Size | D | - | 9 | - |
| Body Size | E | - | 7 | - |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 8 | - |
| Ball Array E | GE | - | 8 | - | |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | - | - | 1.2 |
| Ball Height | A1 | 0.25 | 0.3 | 0.35 |
| Body Thickness | A2 | 0.65 | - | - |
| Ball Diameter | b | 0.35 | 0.4 | 0.45 |
| Body Size | D | 8.9 | 9 | 9.1 |
| Body Size | E | 6.9 | 7 | 7.1 |
| Ball Pitch | e | - | 0.8 | - |
| Ball Array D | GD | - | 8 | - |
| Ball Array E | GE | - | 8 | - | |
Usable for programmer(s):
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days.
We are sorry, that the item is not in stock at the moment. Please ask for availability, click here.
