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DIL48/BGA100-1.01 ZIF eMMC-2
(Ord. no. 70-3347)

See: Adapter manual | Accepted package(s) | Usable for programmer(s) | List of supported devices
  • 70-3347

    Price: US $496.00 [read this!][read this!])
    Price 4-7: US $456.30
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  • specialized adapter for eMMC devices in BGA100 package
  • designed for TurboMode
  • used ZIF socket accepts many variants of supported package, different in ball diameter, ball high and/or body thickness, see section Accepted package(s)
  • operating (mechanical) life of ZIF socket – 10,000 actuations
  • supported from PG4UW software version 3.12k
  • made in Slovakia
Ord. no. 70-3347
Socket ZIF BGA100, OpenTop type
Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil
Class Specialized
Subclass Memory (NOR/NAND/eMMC)
Availability in stock 1 pcs.
Adapter manual
  • Protect the contacts of adapter connectors and ZIF socket from contamination. Any dirt and/or fat on contacts may cause errors during programming.
  • Usage of vacuum pick-up tool is expected for device handling.
  • Proceed with care! Incorrect insertion of adapter in programmer ZIF socket or device in adapter ZIF socket may lead to programmed device damage.

  • Insert adapter into programmer ZIF socket. If you are in doubts about orientation of the adapter in programmer ZIF socket, there is a rule of thumb - orientation of adapter name text is the same as orientation of the text on the top of programmer.
  • Visually check the placement of adapter in programmer ZIF socket.
  • Push the cover of adapter ZIF socket (the topmost movable part) to open the socket. Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane. For correct device orientation, follow the instructions shown on picture in PG4UW software Device info window for device being programmed. Then release adapter ZIF socket.
  • The cover must be fully actuated (depressed) before inserting a device into the socket.
  • Do not press on device while inserting it and/or releasing the cover.
  • Visually check the placement of programmed device in adapter ZIF socket. If everything looks OK, the device is ready for programming.
  • To take out the device from adapter, push the cover of adapter ZIF socket and remove the device.
  • When you finish the work with adapter, remove it from programmer ZIF socket.

  • Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.25--
Body ThicknessA20.911.011.11
Ball Diameterb-0.45-
Body SizeD17.91818.1
Body SizeE13.91414.1
Ball Pitche-1-
Ball Array DGD-17-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.25--
Body ThicknessA2-0.95-
Ball Diameterb0.40.450.5
Body SizeD17.91818.1
Body SizeE13.91414.1
Ball Pitche-1-
Ball Array DGD-17-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA1.21.31.4
Ball HeightA10.25--
Body ThicknessA2---
Ball Diameterb0.40.450.5
Body SizeD17.91818.1
Body SizeE13.91414.1
Ball Pitche-1-
Ball Array DGD-17-
Ball Array EGE-10-
NAMESYMBOLMINNOMMAX
ProfileA--1.4
Ball HeightA10.25--
Body ThicknessA20.931.031.13
Ball Diameterb-0.45-
Body SizeD17.91818.1
Body SizeE13.91414.1
Ball Pitche-1-
Ball Array DGD-17-
Ball Array EGE-10-




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