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  • 70-1118
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  • top board of LGA adapters
  • ZIF socket accepts many variations of LGA packages, that differ in body thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of LGA packages, which are accepted by this LGA-Top board.
  • operating (mechanical) warranty of ZIF socket - 500,000 actuations
  • made in Slovakia
Ord. no. 70-1118
Socket ZIF LGA169 (depopulated array of (144) spring probes), ClamShell type
Connection to BGA-Bottom-X 8x25 + 3x20 sockets for wire wrap pin
Subclass BGA-Top
Availability in stock 1 pcs.
Adapter manual
  • For work with LGA device it is necessary put together LGA-Top-195 ZIF-CS with some LGA-Bottom-x board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the LGA-Top-x ZIF-CS and LGA-Bottom-x boards to have complete LGA adapter

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package Package
Ball HeightA1---
Body ThicknessA2---
Ball Diameterb0.30.350.4
Body SizeD-9-
Body SizeE-9-
Ball Pitche-0.65-
Ball Array DGD-13-
Ball Array EGE-13-

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